最新Cadence ® Allegro® 16.3 技术巡展将为您带来最新PCB与IC封装技术，让您了解即将于2009年底发布的Allegro 16.3系统互连平台。

来自Cadence美国、中国和我们的合作伙伴们将与您分享Cadence最新PCB与IC封装技术发展趋势、产品路线图、技术讲解与演示和使用心得。

主题

·Allegro 16.3 new features and roadmap

·Customer Keynote to share experience and success enabled by Cadence Allegro technologies

·Accelerating Design Intent Creation with Allegro System Architect

·Meeting the Challenges of High Speed DDR3 Memory Interface Design

·Design Data Management for PCB Design

·RF PCB Design

·PCB/FPGA Co-design with FPGA System Planner (FSP)

·What’s New in IC Packaging / SiP

·Switch-Mode Power Supply Design and Analysis with Cadence PSpice Technology

·Cadence VCAD Service for advanced PCB and IC Packaging Design

面向对象

·Allegro 15.x/16.x 用户并期望升级到最新16.3平台以便享用最新功能

·想迁移到Cadence Allegro 技术平台的PCB 和IC 封装设计用户以提升设计效率