PCB设计仿真

利用PCB布局技术实现音频放大器的RF噪声抑制

PCBTech.Net  发布时间:2007-07-27  来源:mentor  点击:
资料类型:国产软件/共享软件 界面语言:英文软件 软件大小: 文件类型:.rar 资料等级:★★★☆☆

资料介绍

    RF immunity, or RF susceptibility, is quickly becoming as important a design consideration as PSRR, THD+N, and SNR in the audio world of cellular phones, MP3 players, and notebook computers. Bluetooth is proliferating as a wirelessserial-cable replacement for headsets and microphones in mobile applications. Wireless LAN (WLAN), using the IEEE 802.11b/g protocol, is practically standard in PC and laptop computers. The TDMA multiplexing scheme found in GSM, PCS, and DECT technologies remains a considerable RF nuisance. Today's dense RF environment raises concerns regarding an electronic circuit's susceptibility to RF and RF's impact on the integrity of the overall system. The audio amplifier is a system block susceptible to RF.

    An audio amplifier can demodulate the RF carrier and reproduce the modulated signal and its harmonic components at its output. Some of the frequencies fall into the audio baseband, producing unwanted audible 'buzz' at the system's speaker output. To avoid this problem, a system designer must fully understand the limitations of the selected amplifier IC and its respective PCB layout. This article will guide designers to optimize the RF immunity performance of an audio amplifier at the board level.

下载地址

说明

    ☉推荐使用网际快车下载本站软件,使用 WinRAR v3.10 以上版本解压本站软件。
    ☉如果这个软件总是不能下载的请点击报告错误,谢谢合作!!
    ☉下载本站资源,如果服务器暂不能下载请过一段时间重试!
    ☉如果遇到什么问题,请到本站论坛去咨寻,我们将在那里提供更多 、更好的资源!
    ☉本站提供的一些商业软件是供学习研究之用,如用于商业用途,请购买正版。
发表评论 共有条评论
用户名: 密码:
验证码: 匿名发表
《集成电路产业发展白皮书(2015版)》发布
《集成电路产业发展白皮书(2
三星下一代智能手表用圆屏
三星下一代智能手表用圆屏
中兴通信市值首次突破千亿大关
中兴通信市值首次突破千亿大
0.2毫米超薄玻璃基板实现量产——打破市场垄断
0.2毫米超薄玻璃基板实现量产

Copyright (C) 2000-2009 PCBTech.Net, All Rights Reserved 版权所有 中国PCB技术网

沪ICP备05006956号 商务联系、网站内容、合作建议:021-54199134

未经版权所有人明确的书面许可,不得以任何方式或媒体翻印或转载本网站的部分或全部内容。

中国PCB技术网-线路板行业五星级网站认证上海颜鸣电子科技有限公司