覆铜基材

Rogers高频基板RT/duroid 6002/6202

PCBTech.Net  发布时间:2007-04-02  来源:mentor  点击:
资料类型:国外软件/免费软件 界面语言:英文软件 软件大小: 文件类型:.rar 资料等级:★★★★☆

资料介绍

    RT/duroid 6000 PTFE/Ceramic laminates

    RT/duroid 6002 (er =2.94), RT/duroid 6202  were developed to address several of the drawbacks of PTFE based materials. Introduced in the late 1980’s, this material’s unique properties are excellent dielectric constant thermal stability and a coefficient of thermal expansion matched to that off copper. This product is ideal for applications in thermal changing environments (space), multilayer constructions due to high reliability of plated through holes as well as in relatively high frequency applications because of its low dielectric loss.

    There are three grades of material from this product family, RT/duroid 6006 (er =6.15) and 6010LM (er =10.2) materials were developed in the late 1970’s to provide an option to designers wishing to reduce the size of the circuit boards. The high dielectric constant of these materials yields smaller signal wavelengths and the circuits can be made smaller.

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