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4.Challenges of high density
Let’s have a look at a group of data:
Change in the packaging of devices in recent years: 
Changes in the PIN number of component and the total PIN number of PCB in the IT industry over the past 20 years ：
Drawing 3: Changes in the PIN number of component and the PIN number of PCB
Changes in the layers of PCB in the IT industry over the past 20 years :
Drawing 4: Changes in the layer number of single boards
Changes in PIN density (Pin density, Pins/sq in) of single boards over the past 20 years:
Drawing 5: Changes in PIN density
According to the above diagram, we can learn that the design density of PCB tends to become higher. When we went from boards full of jumping wires 20 years ago, to subsequent double-sided boards and multilayer boards and to packaging changes of devices as well as the booming HDI technology promoted by the industry of mobile phones in recent years including Menlow platform introduced by Intel recently, HDI technology has been widely used in PC industry.
With increasing promotion of design density of PCB, PCB engineers have to keep pace with the frontier fields of scientific research in the industry, have a good knowledge of new materials and technologies and adopt advanced EDA software supporting high-precision PCB design so that they can meet the challenges facing the increasing density in the course of product research and development. It is said that SPB 16.2 introduced soon will have a great breakthrough in the design of HDI, which we are looking forward to.
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08-07-21
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