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• Engineering Implementation of High Performance PCB Design
• 来源：EDADOC     作者：Hans Axiao Bridge Tang     发布时间：2008-07-23 08:12:01    评论(0条)  
  

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• 中文版请点击：高性能PCB设计的工程实现

  Abstract:

  In this article, the author describes the design of high-performance PCB in details integrating with the powerful functions of Cadence software, guides to Engineering Implementation of High Performance PCB Design.

  Text:

  Following the Moore’s law, the products in the electronics industry tend to be more powerful, complicate, with a higher integration level, higher speed and shorter R&D cycle. The PCB design also meets a booming age of high-speed PCB design. PCB is not only a carrier to realize the interconnection, but also a very important component for all of electronics products. In this article, with an overview of high-performance PCB design, all of the aspects about design of high-performance PCB will be discussed.

  First of all, successful high-performance PCB design heavily depends on a team of experienced PCB design experts.

  I. Suggestions about organization of PCB design team

  With the high-speed development of PCB design, professional PCB engineers have come into existence in charge of PCB design instead of the hardware engineers, while both schematic and PCB design were done by hardware engineers alone.

  A well-rounded large and middle-sized PCB design team shall consist of the following:

  Library engineers: they shall be specialized in creating PCB footprints, having a good knowledge of technological capacity and technical parameters of main board and chip manufacturers at present, and completing the footprint of high-speed and high-precision PCB according to the practical conditions of products of this company.

  PCB design engineers: they shall have a wide range of knowledge about PCB, including basic knowledge about electronic circuits, general knowledge about production of PCB, processing of SMT, and DFX (DFM/DFC/DFT). Furthermore, they should know about the stackup design, impedance control, signal integrality analyse and EMC knowledge about high-speed PCB, take into account all kinds of requirements for modern PCB design and complete the placement and routing for PCB.

  SI engineers: they shall have the ability to reveal the “concealed schematic diagram” in the PCB transmission line, and deal with the problems of reflection, crosstalk and timing in high-speed development. In addition, they shall carry out detailed simulation to ensure the quality of signal, raise the one-time success rate of products, and ensure PCB a stable and reliable operation. 

  EMC engineers: they, as required, are in charge of EMC design relevant to circuits, components and PCB , reducing the radiation and enhancing the ability to reduce and tolerate the interference from outside.

  Thermal engineers: the thermal engineers are absolutely necessary for a R&D team in pursuit of products with a small and exquisite structure. They are able to ensure the products a stable and reliable operation by analyzing the distribution of heat sources, designing a suitable duct system and controlling the temperature in the system. Therefore, without thermal engineers, it is impossible to design the notebook computer with high performance and stability. (Notes: the structural engineer is concurrently in charge of thermal simulation and design of PCB in some companies). 

  Process engineers: they are responsible for working out the technological parameters of PCB design for their company according to the technological capacity of PCB manufacturers, assembly providers. They also participate in design of some board and PCB designs to ensure the production and processing of PCB.

  For the sake of communication, technological advancement as well as personnel backup, each type of engineers as mentioned above shall be no less than 3 persons. For those companies with limited resources and uncertain needs for research and development, they may as well reserve some interdisciplinary talents and seek suitable outside resources to make up for the disadvantage in research and development.       

  Let us have a look at the organization course of PCB design team of IT industry:
    In 1980, the hardware engineers are in charge of PCB design;
    In 1990, CAD engineers come into existence in a special department;
    In 1995, professional PCB design house comes into vogue in North America and Japan;
    In 2000, with increasing specialized division of work, PCB design, SI, EMC, thermal design and technique etc are separated form each other. More than 50% of PCB design in North America and Japan is completed by professional design companies. Furthermore, SI and EMC and so on gradually function under a system of its own.
    In 2003, some professional design companies in the wake of Shenzhen EDADOC Technology CO., LTD take the concept of PCB design outsourcing into China;
    In 2008, within companies, a definitive division of work, complete types of work, suitable outsourcing and technological outsourcing come into fashion.
  

  
  
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